Snapdragon 670 With 10pm LPP Process and Using Core Kyro 360

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Qualcomm has announced the latest mid-range chipset named Snapdragon 660, which the smartphone has a performance that is not less far than the current flagship chipset. But until now still a handful of smartphones that carry the new mid-range chipset, such as Oppo R11 and Sharp Aquos S2. Although not many smartphones that carry Snapdragon 660 chipset, recently has been circulating rumors about the successor, Snapdragon 670.
As Gizmochina reports, the next-generation chipset of the 660 Snadpragon will be built with 10nm LPP (Low Power Plus) manufacturing process which is certainly good news, considering the next flagship chipset will jump to the 7nm process. But keep in mind that this LPP is better than LPE (Low Power Early) on Snapdragon 835, which means we can expect improved performance as well as better power efficiency.
In addition, this chipset will have an octa-core processor that uses a third-generation core called Kyro 360. This new Core will use the new Dynamiq architecture, which is the successor of the ever popular architecture of ARM’s big.LITTLE. For configuration, this chip is said to use a high-powered Kryo 360 dual-core and low-power Kryo hexa-core. As for the graphics processor using the latest GPU Adreno 600.

According to leaked circulation, mass production of this latest mid-range chipset will begin in the first quarter of 2018.

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