Toshiba’s transition to 64-layer NAND 3D flash memory is likely to continue as the launch of its flagship third generation BGA SSD, the BG3 Series. In addition to being marketed in a fixed position and soldered directly to the circuit board, Toshiba also sells a single packet SSD series to the manufacturer of the form factor M.2 2230.
Now after the full support of Windows 10 on the latest innovative technology called Host Memory Buffer (HMB), the current M.2 model has been marketed as an alternative to low cost SATA DRAMless SSDs. Available in three capacity choices128GB, 256GB and 512GB, the BG3 Series uses up to 38MB of system memory to make up for not using embedded DRAM buffers, claiming to offer up to 1,520MBps sequential read performance.
The Host Memory Buffer improves random performance over products that use architecture without DRAM. Toshiba claims 80-150% random access increase at high queue depth. While exhibiting BG2 in Flash Memory Summit last year, Toshiba had to load the motherboard BIOS and special drivers to run on Windows. But that seems no longer necessary today, given that motherboard manufacturers and Microsoft are said to have now put the necessary components to bring that technology to market.
As Jeremy Werner, who currently serves as vice president of SSD marketing and product planning at Toshiba America Electronic Components, Inc., the third generation Toshiba BG SSD is designed to spark a revolution in mobile and IoT computing. The BG3 series is not only smaller and lighter, but smarter thanks to a cost-effective DRAM-less design with HMB technology combined with 64-layer Toshiba 3D flash memory with TLC technology. This SSD allows OEMs to reconsider what is possible for their customers.
The new BG3 will be part of Toshiba’s drive to divert all flash-based products to the latest FLASH BiCS. SSD is said to have been equipped with controller and memory FLISH BiCS 64-layer 3-bit per cell (TLC) is the latest Toshiba is the same as what is owned by the XG5 model. Another aspect of this drive will include a new RD model based on XG5 leading to retailers later this year, as well as an entry-level DRAMless (TR200) drive that will arrive even faster.
For those who want to know more about this latest BG3, TR200, and XG5 products made by Toshiba, there is nothing wrong with waiting for Flash Memory Summit next week!